♦ Current Research
Study for Phase Change Cooling for Densely packed Electronic Package
Rapid development in the design of electronic packages in the semiconductor industry has led to very high heat flux (80-100 W/cm^2) on the chip surface. Air cooling using conventional materials such as aluminum and copper is not capable for removing such high heat fluxs for maintaining a proper operational temperature. It is imperative to explore new techniques to cool high-speed electronic components. Metal and graphite foams are novel high thermal conductivity materials with large surface areas of between 500 and 10,000 m^2/m^3.
It is conceivable that applying porous foams in phase change system will provide extremely large contact surface area between the solid and fluid phases , which will significantly increase the overall heat transfer performance. The aim of the research is yo utilise the capacity of porous evaporators and to develop guidelines for design of an an effective and compact cooling device for densely-packed electronic packages.
